広東発の精密PCBが、
日本から届く。
多層リジッド・HDI・FPC・リジッドフレックス・金属基板まで。
MESスマート工場と国際認証で、車載・産機・通信・医療を支えます。
日本語対応のAPAC拠点（つくば）が窓口です。
廣東精密PCB，
從日本出發。
從多層硬板、HDI、FPC、軟硬結合板到金屬基板，
依託MES智慧工廠與國際認證，支援車載、工業、通訊與醫療應用。
日本APAC窗口（筑波）提供全語言服務。
邁向次世代PCB製造的三大優勢
高附加價值量產、智慧工廠、國際第三方認證。
高難度・高附加價值產品
支援HDI、盲埋孔、多層（規劃最多40層）、微細線路、金屬基板與軟硬結合板，穩定量產技術難度高的產品。
MES智慧工廠
整合MES、ERP/EAPS、能源管理與5G園區，以製程數據驅動品質改善與全流程追溯管理。
國際認證・品質保證
取得IATF16949（車載）、ISO13485（醫療）等7項以上國際規格，以第三方認證客觀保證品質。
製造能力
硬板、FPC、金屬基板，三大類別一站式對應。
FR-4 硬板（多層）
從標準到高難度全面對應
| 層數 | 2〜20層（規劃最大40層） |
| 最小鑽孔 | φ0.10mm |
| 最小 L/S | 2/2 mil |
| 材料 | FR-4 / 高頻材 / BT / 混合材 |
| 表面處理 | OSP, ENIG, ENEPIG, ImmAg, ImmSn |
FPC / 軟硬結合板
薄型、長尺寸、複合結構對應
| 結構 | 1〜12層（規劃最大30層） |
| 最薄厚度 | 0.07mm |
| 長尺寸 | 最大1500mm（規劃） |
| 補強材 | FR-4 / 不鏽鋼 / 鋁 / 銅 / PI / PET |
| 電性測試 | 專用/通用/二線/四線/高壓 |
金屬基板（銅/鋁）
高散熱、高電流應用專用
| 層數 | 1〜4層（規劃最大8層） |
| 長尺寸 | 〜1500mm（規劃） |
| 導熱率 | 1〜8 W/m·K |
| 加工 | 熱電分離 / 埋銅 / 控深加工 |
| 表面處理 | OSP, ENIG, ENEPIG, ImmAg, ImmSn |
技術規格一覽
依材料、層構與表面處理整理代表值，可依圖面與用途進一步最佳化。
| 分類 | 層構・材料 | 主要規格 / 特點 |
|---|---|---|
| FR-4 硬板 | 2–20層（規劃40層）/ FR-4・BT・混合材 | L/S 2/2mil、最小孔φ0.10mm、盲埋孔/堆疊/階梯孔、阻抗控制 |
| HDI | 1+n+1、m+n+m / μVia | LDI曝光、VCP鍍銅、stacked/staggered、樹脂埋孔/鍍銅平坦化 |
| FPC / R-Flex | 1–12層（規劃30層）/ PI銅箔基材・Coverlay | 最薄0.07mm、長尺寸〜1500mm、補強：FR-4/PI/不鏽鋼/銅/鋁 |
| 鋁/銅 1–4層（規劃8層） | 導熱 1–8 W/m·K、熱電分離、埋銅、控深加工、長尺寸〜1500mm |
| 項目 | 代表值（參考） | 備註 |
|---|---|---|
| 最小孔徑 | φ0.10mm | 規劃更小 |
| 最小線寬線距 | 2/2 mil（約0.05mm） | 依設計/材料 |
| 板厚 | 0.07〜3.2mm | 依結構不同 |
| 銅厚 | 內層 1/3〜3oz / 外層 1/2〜3oz | 可提供VE建議 |
| 表面處理 | OSP, ENIG, ENEPIG, ImmAg, ImmSn, LF HASL | 依用途選定 |
| 阻抗 | 目標 ±10% | 提供測試報告 |
| 長尺寸 | 〜1500mm（FPC/金屬） | 依搬送條件 |
認證・獎項・適用產業
Guangdong-precision PCBs,
delivered from Japan.
Multilayer rigid, HDI, FPC, rigid-flex, and metal-core PCBs —
backed by a MES smart factory and international certifications.
Our Japan APAC hub (Tsukuba) responds in EN / JP / CN.
3 Core Strengths for Next-Gen PCB Manufacturing
High-value mass production, smart factory systems, and third-party certifications.
High-Difficulty / High-Value Products
HDI, blind/buried vias, multilayer up to 40 layers (planned), fine patterns, metal-core PCBs, and rigid-flex — for designs that go beyond standard.
MES Smart Factory
Integrated MES, ERP/EAPS, energy management, and 5G campus. Real-time process data powers quality improvement and full traceability.
International Certifications
IATF16949 (automotive), ISO13485 (medical), and 7+ other international standards. Third-party certification as objective quality proof.
Manufacturing Capabilities
Rigid, FPC, and metal-core PCBs — all three categories under one roof.
FR-4 Rigid (Multilayer)
Standard to high-complexity builds
| Layers | 2–20 (planned 40) |
| Min drill | φ0.10mm |
| Min L/S | 2/2 mil |
| Materials | FR-4 / High-freq / BT / Hybrid |
| Surface finish | OSP, ENIG, ENEPIG, ImmAg, ImmSn |
FPC / Rigid-Flex
Thin, long-panel, and complex structures
| Layers | 1–12 (planned 30) |
| Min thickness | 0.07mm |
| Long panel | up to 1500mm (planned) |
| Stiffeners | FR-4 / SUS / Al / Cu / PI / PET |
| Electrical test | Dedicated / universal / 2-wire / 4-wire / HV |
Metal Core PCB (Cu/Al)
High thermal / high current applications
| Layers | 1–4 (planned 8) |
| Long panel | up to 1500mm (planned) |
| Thermal conductivity | 1–8 W/m·K |
| Features | Thermal-elec. separation / Cu inlay / depth control |
| Surface finish | OSP, ENIG, ENEPIG, ImmAg, ImmSn |
Technical Specifications
Representative values by material, stack-up, and surface finish. Optimized per drawing and application.
| Category | Stack-up / Materials | Main Specs / Features |
|---|---|---|
| FR-4 Rigid | 2–20L (planned 40) / FR-4, BT, Hybrid | L/S 2/2mil, min hole φ0.10mm, blind/buried vias, stacked/staggered, impedance control |
| HDI | 1+n+1, m+n+m / μVia | LDI imaging, VCP plating, stacked/staggered, resin fill / Cu planarization |
| FPC / R-Flex | 1–12L (planned 30) / PI copper-clad / coverlay | Min 0.07mm, long panels to 1500mm, stiffeners: FR-4/PI/SUS/Cu/Al |
| Al/Cu 1–4L (planned 8) | 1–8 W/m·K, thermal-electric separation, Cu inlay, controlled-depth machining |
| Item | Typical Value | Notes |
|---|---|---|
| Min hole | φ0.10mm | Smaller planned |
| Min L/S | 2/2 mil (~0.05mm) | Depends on design / material |
| Board thickness | 0.07–3.2mm | Depends on structure |
| Copper weight | Inner 1/3–3oz / Outer 1/2–3oz | VE proposals available |
| Surface finish | OSP, ENIG, ENEPIG, ImmAg, ImmSn, LF HASL | Selected by application |
| Impedance | Target ±10% | Reports available |
| Long panel | Up to 1500mm (FPC/metal) | Subject to handling conditions |
Certifications, Awards & Applications
Japan Contact Base & Global Network
Tsukuba hub — one-stop support
- Single contact for Sales, FAE & QA (JP / EN / CN)
- Drawings, quotes, audits, and import/export documents
- Prototype-to-mass-production phased rollout coordination
- First response and escalation for urgent cases
Global Manufacturing & Sales Bases
Centered on Guangdong manufacturing, expanding across Asia and North America.
Let's talk about your PCB needs
Share your drawings, specs, or application details — we'll propose the right board type, cost, and lead time.